Backplate Assembly Inspection

Project Background

Inspection Background

With the increasing demands for battery safety and reliability in industries such as new energy vehicles, energy storage systems, and consumer electronics, the manufacturing precision and assembly quality of battery casings have become key factors affecting product performance. As the core structural component of a battery pack, the stud positioning, regional flatness, and sealant path quality on the battery casing surface are directly related to the overall structural sealing, shock resistance, and long-term stability. Any minor deviation, such as stud tilt, flatness exceeding tolerance, or sealant path defects, can lead to assembly failure, poor sealing, or even safety hazards.

To meet the high-precision, high-efficiency quality control requirements, there is an urgent need to develop an automated full-size inspection system for the surface features of battery casings. This system needs to accurately measure stud tilt, small-area flatness, and inspect the completeness of the peripheral sealant path, ensuring that every key feature meets strict process standards, thereby improving product yield and ensuring the long-term reliable operation of the battery system.

Camera Selection

Shenshi SR7240

Measurement Items

Sealant path measurement, flatness of three areas on the PCB surface, height difference between the PCB and the surrounding substrate, angle between the nut stud and the substrate.

Solution

AI-VISION first establishes the product datum plane, acquires a 2D image for sealant path measurement, uses the 3D point cloud to measure surface flatness and PCB height difference, and finally measures the stud angle.

Design Approach

Execution Results Showcase

• Project Results Display

  • Inspection Results

Project Process

1. Initialization

1. Use the Load Point Cloud tool to load the point cloud image that needs processing.

2. Use the 3D Point Cloud Crop tool to crop the point cloud of the sealant path section.

3. Use the Plane Fitting tool to fit the plane for the sealant path point cloud and the datum plane of the initial point cloud, respectively.

4. Use the 3D Point Cloud Ordering tool to set the XY direction resolution for the sealant path point cloud.

5. Use the Point Cloud to Depth Map tool, set the XY direction resolution, and convert the sealant path point cloud into a depth map.

2. Sealant Path Inspection

Use the Sealant Path Inspection - Trajectory tool, input the point cloud and depth map, to detect the sealant path width and check for breaks.

3. Flatness Inspection

1. Use the Create ROI tool to create a box array.

2. Use the 3D Flatness tool, bound to the ROI array created in the previous step, to measure the regional flatness.

4. Height Measurement

1. Use the Create ROI tool to create box arrays on the PCB board and the reference area, respectively.

2. Use the 3D Flatness tool, bound to the ROI arrays created in the previous step, to measure the height of the PCB board and the reference area respectively.

5. Stud Angle Measurement

1. Use the 3D Square Probe tool to find the planes of the stud surface and the reference area, respectively.

2. Use the 3D Angle tool to calculate the angle between the stud surface and the reference area surface.